Justin Tsai has extensive experience in the semiconductor industry, having worked at 台積電 from June 2015 to October 2022 as a Product Engineer, where contributions included resolving assembly issues for fingerprint sensors and significantly improving 3D SoIC hybrid bond yield. Prior to this role, Justin served as a Research and Development Engineer at TSMC from January 2011 to June 2015, successfully developing the TSV process and facilitating the production of the first TSV product. Currently, since October 2022, Justin holds the position of Technical Program Manager at 蘋果公司, focusing on optical sensing applications and supply quality management. Justin Tsai earned a Master's degree in physics from 國立臺灣大學 from 2004 to 2006.
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