Lei Feng

Engineering Manager in Package/SI/PI

Lei Feng is an Engineering Manager in Package/SI/PI at Apple, where they currently establish new technical domains in RF Integrity and RF Power Integrity. Previously, they held the position of RFIC Manager at Intel Corporation for a decade, leading the development of WiFi/BT products and 5G millimeter wave technologies. Lei has also contributed to RF system architecture and mixed signal IC design in their earlier roles at RFMD and Huawei. They are pursuing a PhD in communication circuit and system at the University of Southern California, having completed a BS and MS in Electrical and Electronics Engineering from Peking University.

Location

San Jose, United States

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