Lei Nie is a Senior Manager in reliability engineering at Apple, specializing in the mechanical, material, and thermal properties of consumer electronics. They possess a comprehensive understanding of reliability, supported by abundant manufacturing experience in electronic packaging and surface mount technology. Previously, Lei worked at Intel Corporation as a Process TD Engineer and contributed to hardware reliability for Amazon's Kindle at Lab126. They have also held the position of Apple Reliability Engineer before their current role. Lei is pursuing a Bachelor and Master’s degree at Tsinghua University in Materials Science and Engineering and Microelectronics, respectively, while also working towards a PhD in Mechanical Engineering at the University of Maryland.
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