Myung Yim

Myung Yim is an experienced Packaging Technologist currently employed at Apple since January 2018. Prior to this role, Myung Yim served as an Engineering Manager at Intel Corporation, overseeing a packaging and assembly process development team for silicon photonics components. Myung Yim also held the position of Senior Staff Packaging Engineer at Intel, focusing on wafer bumping and chip-on-chip die stacking. At Broadcom, Myung Yim worked as a Principal Packaging Engineer, leading supply chain management and manufacturing processes for advanced packaging technologies. Earlier experience includes roles at GLOBALFOUNDRIES as a Member of Technical Staff and at Micron Technology as a Senior Packaging Engineer, specializing in memory and system packaging technology. Myung Yim earned both a Ph.D. and an MS in Materials Science and Engineering from the Korea Advanced Institute of Science and Technology.