Quan Qi

Quan Qi is an experienced hardware engineering professional with a Ph.D. in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign. They have held various roles across prominent technology companies, including Apple, Intel, and Cisco, focusing on advanced packaging technologies in wireless communication, medical devices, and semiconductor applications. Currently, Quan Qi works as a SiP/PCB Technologist and Engineering Manager at Apple, where they leverage their extensive expertise in electronics packaging, project management, and supplier relations to drive innovation and strategic advancements in the field.