Rekha G.

Rekha G. is an advanced packaging architect with a strong background in semiconductor design, ranging from System on Chip (SoC) design to device-level understanding. With over two years of experience at Qualcomm, Rekha has developed expertise in VLSI digital system design and embedded systems. Currently employed at Apple, Rekha focuses on advanced interconnect technology and 3DIC integration. Rekha earned a Ph.D. in Computer Engineering from the University of South Florida, with research interests in low power circuits and emerging memory technologies. They are dedicated to creating impactful opportunities through technology research and development.