Thomas Yang

Thomas Yang is an Engineering Manager at Apple, where they lead RF and mmWave SIP module development. They have previously held engineering positions at Qualcomm, where they pioneered several innovations in semiconductor packaging, including the introduction of lead-free packages and optimized assembly processes. Thomas's experience also includes an internship at Kyocera North America and a research internship at UCSD, contributing to advancements in electronic packaging and materials science. They are currently pursuing a Master’s and a Bachelor’s degree in Materials Science and Engineering and Mechanical Engineering, respectively, at UC San Diego.