W. Chris Chen is a 3D-IC expert professional at Apple, where they lead efforts in 3D-IC technology within the Silicon Engineering Group. With extensive experience in advanced packaging, they previously served as an R&D Technical Manager and Principal Engineer at TSMC, overseeing research initiatives and managing technology transfers for high volume manufacturing. Additionally, W. Chris Chen holds a PhD in Materials Science and Engineering from National Taiwan University, where they graduated in the top 5% of their class.
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