Ying-Da Wang is a Senior Module Process Engineer at Apple, where they focus on emerging interactive touch development from concept validation to mass production for products such as AirPods Pro, iPhone, and iPad. Prior to Apple, they served as an Application Engineer at DuPont, engaging with tier 1 customers in post-CMP cleaning solutions and wafer-level packaging. Ying-Da also worked as a Senior R&D Engineer at TSMC, contributing to the early development of 3DIC technology, including the world's first InFO package. They hold a Master's degree in Materials Science and a Bachelor's degree in Chemical Engineering from National Taiwan University.
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