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Apple
Unverified
Packaging Engineering
87 people · 0 jobs
This department focuses on the design, testing, and integration of innovative packaging solutions for integrated circuits and related technologies.
Advaitha Byereddy
Packaging PD Engineer
Ajitha Krishnanunni
IC Package Design Engineer
Alison Mitchell
Design Project Manager, Packaging
Amir Bahrololoumi
IC Packaging Simulation Engineer
Amish Naik
IC Package Engineer
Andrew Brown
Packaging Substrate Engineer
Ankur Agrawal
IC Packaging Engineer
Arun Sasi
Bilal Elsayed
Carley Holcomb
Packaging Compliance Engineer
Chang Mao-yen
IC packaging technologist
Chonghua Zhong
Microelectronic Packaging Engineering Manager
Connor Cheng
Packaging Engineering Program Manager
DaeByoung Kang
Packaging engineer
Endrina Forti
IC Packaging Materials Engineer
Eric J. Li
IC Packaging Technologist
Fang Yu
Packaging Engineer
Fatema Parvez
Camera Packaging Engineer
Flynn Carson
Greg Lee
Guangqi Ouyang
IC packaging engineer
Hailey H.
Associate Test Engineer, Packaging Product Design
Hanju Oh
IC package engineer
Haoxiang Ren
Harrison Chung
Heidi Ho
Hsiu-Ping Wei
Hyelim Do
Jacqueline Beals
Packaging Engineering Program Specialist
Jiefeng Xu
Senior IC Packaging Engineer
Jihoon Oh
Jimin Yao
Jiongxin Lu
Jixuan Gong
Mechanical Engineer (IC Packaging)
Jordan Russell
Engineering Program Manager - Packaging Product Design
Kelsey Kiefiuk
Packaging Design Engineer
Kevin Pagano
Test Engineering Manager, Packaging
Maggie Hu
Mahesh Hardikar
Maisie Dai
Matthew Hart
Menglu Li
Michael M.
Mike Long
Sr. Packaging Engineer
Mikel Miller
Myung Yim
Packaging Technologist
Nathan Huang
Nicholas Lanctot
Packaging Test Engineer Manager
Nicole Ligh
Engineering Program Manager, Packaging
Oliver Zhao
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