Anthony Chan has extensive experience in the semiconductor industry, currently serving as the TSV Technology Manager at Applied Materials since July 1996, specializing in Metal Deposition TSV Technology. Prior to this role, Anthony held positions as Key Account Technology Manager and Member Technical Staff at the same company. Earlier experience includes a role as a Coop Intern Engineer at IBM Yorktown Heights in 1988, where responsibilities included characterizing sputtered silicon dioxide film. Anthony earned a PhD in Physics from Rensselaer Polytechnic Institute (1996) and a BS in Engineering Physics from the University of California, Berkeley (1989).
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