Benjamin Briggs

Benjamin Briggs is an accomplished technology development professional currently serving as Director of Technology Development at Applied Materials, where management of the Device and Process Integration Team focuses on Wide Bandgap and Advanced Packaging since July 2022. Prior experience includes roles as Senior Research and Development Engineer at PsiQuantum and Senior Process Integration Engineer at Applied Materials, specializing in areas such as LCoS, uLED, and Heterogeneous Integration. Benjamin also contributed as a Semiconductor Process Integration Engineer at IBM Research, earning recognition as an IBM Master Inventor. Early career experience includes a Graduate Research Assistantship at the College of Nanoscale Science and Engineering, where research centered on advanced encryption applications, as well as co-op and student help desk roles. Benjamin holds a Ph.D. in Nanoscale Engineering from the University at Albany and a BS in Electrical Engineering from SUNY New Paltz.