Bryan Liao is a Thin Films and Plasma Processing Engineer with extensive experience in plasma technology and thin film processing. They worked at Lam Research as a Senior Process Engineer, developing PECVD processes for 3D NAND structures and collaborating with global teams. At Applied Materials, Bryan held multiple roles including Staff RF and Plasma Engineer, focusing on plasma RF power sources and troubleshooting plasma modes. Previously, they served as Manager of Plasma and Process Engineering at SPP Technologies, leading innovative chamber technology developments. Bryan earned a Bachelor of Science degree in Chemical Engineering and Engineering Physics from the University of California, Berkeley.
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