Daniel Blum is a seasoned program manager with over 18 years of experience in the security and semiconductor industries. They currently serve as the Director and Head of Program Management in the eBeam Defect Control Division at Applied Materials, where they lead a portfolio of innovative, multi-disciplinary products. Previously, Daniel held various positions at Intel, including Firmware & Software Technical Project Manager and Firmware & Software System Engineering Team Lead. They also contributed to academia as an Academic Lecturer at The Jerusalem College of Engineering, focusing on bridging industry practices with academic knowledge. Daniel holds an MSc in Computer Science and an MBA, both from The Hebrew University, along with a BSc in Computer Science.
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