Deyang Li is a Process Engineer III Senior at Applied Materials, where they focus on conductor etch logic. They have a Ph.D. in Chemical Engineering from Northeastern University and have previously held positions as an Electroplating Process Engineer at Microfabrica and an Electrochemical Engineer at Hutchinson Technology Inc., where their work included studies in copper plating chemistry and electroless plating methods. With a strong commitment to research and collaboration, Deyang is eager to further develop their expertise in electrochemistry and electrochemical engineering.
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