Feng Qiao is a Senior Process Engineer at Applied Materials since February 2016, contributing expertise in advanced process engineering. In addition, Feng serves as an Editorial Board Member for iMedPub LLC, managing the publication process for the journal Insights in Analytical Electrochemistry. Previous roles include Electrochemist at ECI Technology, Inc., focusing on copper plating additives, and Research Assistant at Columbia University, where significant contributions were made to the understanding of copper nucleation and electrochemical reactors. Feng has a comprehensive educational background in Chemical Engineering, holding a PhD and MSc from Columbia University, along with a Bachelor's degree from Tianjin University. Additional experiences include an R&D internship at IBM and leadership in various research projects.
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