Jing Yang is a seasoned process engineer with extensive experience in the semiconductor industry, currently serving as a Staff Process Engineer at Applied Materials since July 2020, and previously as a Senior and Process Engineer specializing in etch processes. Prior to this role, Jing worked at Nanolab Technologies as a Manager and Failure Analysis Engineer, overseeing an electron imaging metrology group and handling project planning, task assignment, and customer communication. Educational qualifications include a Master’s degree in Materials Science and Engineering from The University of Texas at Dallas, a Master of Science in Physics from the University of South Carolina, and a Bachelor of Science in Physics from Jilin University. Jing has contributed to several professional presentations related to chemical bath deposition and has a strong background in thin film processing and vacuum chamber technology developed during time as a Graduate Research Assistant at both the University of Texas at Dallas and the University of South Carolina.
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