Jun Feng is a Sr. Manager at Applied Materials, specializing in semiconductor process engineering with over a decade of experience in thin film materials research. Jun holds a Ph.D. in Chemistry from Harvard University and a Bachelor's degree from the University of Science and Technology of China, where they graduated in the top 1%. They have a strong background in advanced node developments for 3DNAND/DRAM applications, contributing to over 16 publications with more than 2000 citations. Throughout their career, Jun has excelled in process automation, data analytics, and project management, engaging with leading customers in the semiconductor industry.
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