Lan Yu is a scientist and engineer specializing in device, process, and integration engineering. They served as a Research Assistant at the University of Illinois at Urbana-Champaign from 2011 to 2016, managing lab operations and developing mid-infrared emitter devices. From 2017 to 2019, they worked as a Device and Integration Engineer at IBM, focusing on advanced logic technology and the 2nm GAA junction module. Currently, Lan Yu is a Senior Process Integration Engineer at Applied Materials, where they research leading-edge semiconductor advancements.
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