Ming Liu is a highly motivated researcher specializing in advanced packaging, heterogeneous integration, and computational modeling & simulation. Ming has served as a Design Engineer at Applied Materials since 2022, following roles as a Hybrid Simulation Intern at Siemens and various research assistant positions at Michigan State University, where they focused on the design and optimization of multiphysics lattice structures. With a Ph.D. in Mechanical Engineering from Michigan State University and prior degrees from UC San Diego and Zhengzhou University, Ming possesses a robust educational background that complements their extensive industry experience.
Location
San Francisco, United States
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