Rain Lei is a Senior Director of Process Engineering at Applied Materials, where they have been shaping advanced materials solutions since 2010. With extensive experience in developing innovative processes such as selective CVD and ALD technologies for next-generation semiconductor applications, Rain has played a pivotal role in penetrating major logic customers across various technology nodes. Rain has also achieved significant advancements in metal gapfill processes that are integral to modern computing devices, including iPhones and various CPUs. Currently, Rain is pursuing degrees in Electrical Engineering and Chemistry at prestigious institutions, further enhancing their expertise in solid state electronics and microelectronics.
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