Uday Pai

Uday Pai is a Senior Staff Mechanical Engineer at Applied Materials, where they have developed a robust background in semiconductor equipment over fourteen years. Since 2008, Uday has successfully led projects focused on next-generation PVD systems and has optimized hardware for various applications within the packaging industry. Prior to this role, Uday was a Senior Mechanical Engineer at Lam Research Corp, where they were responsible for the design and implementation of Plasma CVD systems. Uday holds a Master’s degree in Mechanical, Aerospace and Materials Engineering from the Illinois Institute of Technology and a Bachelor’s degree in Mechanical Engineering from Manipal Institute of Technology.