Yaoling P.

Yaoling P. has extensive experience in engineering and technology management, currently serving as Director of Engineering at Applied Materials since June 2017, focusing on MEMS-based sensing technologies. Prior to this role, Yaoling held the position of Director of Engineering at Qualcomm Research Center from 2009 to June 2017, where responsibilities included semiconductor device technology and advanced packaging. Previous positions include Process Integration/Device Engineering/Project Engineer at Sarnoff Corporation, where work involved process development for imaging sensors, and Principal Investigator at Nanosys, specializing in silicon Nanowire FET development. Early career experience includes managing CMOS process integration at HP/Agilent from 1996 to 2002. Education was obtained at Rutgers University.