Daniel M.

Daniel M. has extensive experience in physical design engineering, having worked at prominent companies such as Intel Corporation and Qualcomm. At Intel Corporation from March 2022 to August 2024, Daniel M. served as a Physical Design Engineer, focusing on hierarchical hard macro ownership in the Modem subsystem for high-tier SoCs, managing key tasks such as floorplanning, place and route, clock tree synthesis, and physical verification. Prior to this, experience at Qualcomm from February 2019 to February 2022 included similar responsibilities in physical design and verification. Daniel M.'s earlier roles included an internship at NXP Semiconductors in 2017, where power estimation and analysis were key elements of the work, as well as a position at Arm that began in August 2024. Daniel M. holds a degree in Electrical Engineering from Universidade Estadual de Campinas, obtained in 2017, and completed Ensino Médio at Colégio Divino Salvador in 2012.