Mervyn Liu has extensive experience in applications engineering and technical support within the semiconductor industry. Beginning with Conexant as a Product Application Engineer from March 2007 to July 2008, Mervyn developed device drivers and middleware for STB products. Mervyn then transitioned to NXP Semiconductors as an Application Engineer, supporting customer projects from board bring-up to mass production from August 2008 to February 2010. Subsequently, Mervyn worked at Trident Microsystems as an Application Engineer, focusing on DVB-S2 HDTV solutions until May 2011. Mervyn continued at LSI Corporation as a Senior System Application Engineer from June 2011 to January 2014, providing technical support for multi-core processors. Currently, Mervyn serves as an FAE at ARM since June 2014. Mervyn holds a Master's degree in Electrical, Electronics, and Communications Engineering from Shanghai Jiao Tong University, completed in 2007.
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