Moïse Saha is a Staff Packaging Engineer at Arm, specializing in analog and system-in-package (SIP) design integrated circuits. They previously worked as a Senior Packaging Engineer at Teledyne e2v and held consultancy roles at various companies, including Atmel Corporation and STMicroelectronics, gaining extensive experience in analog design and packaging solutions. Moïse earned a degree in Analog Microelectronics from Université Blaise Pascal and a Master’s in Physics from Université des Antilles.
Location
Antibes, France
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