Moïse Saha is a Staff Packaging Engineer at Arm, specializing in analog and system-in-package (SIP) design integrated circuits. They previously worked as a Senior Packaging Engineer at Teledyne e2v and held consultancy roles at various companies, including Atmel Corporation and STMicroelectronics, gaining extensive experience in analog design and packaging solutions. Moïse earned a degree in Analog Microelectronics from Université Blaise Pascal and a Master’s in Physics from Université des Antilles.
This person is not in the org chart
This person is not in any teams
This person is not in any offices