Nitin Juneja

Nitin Juneja is an IC Packaging Architect currently at Arm, with a robust background in semiconductor packaging, design, signal integrity, and power integrity. Nitin has held significant positions at companies such as Qualcomm, Rambus, and AMD, where they successfully developed and implemented packaging strategies for various products. With a deep understanding of modern packaging technologies, Nitin specializes in package design, thermal analysis, and vendor development. They are currently pursuing a MASc at the University of Toronto, alongside degrees in Engineering from The Maharaja Sayajirao University of Baroda and a certificate in Management Science and Engineering from Stanford University.