威宏 賴 is currently the Technical Deputy Manager of R&D Stress Lab at 日月光, where they lead the mechanical simulation team and are involved in advanced packaging processes. With over 10 years of experience in ANSYS Mechanical APDL coding and thermal simulation management, 威宏 has contributed significantly to risk assessments for advanced packages and assembly processes. Previously, 威宏 held roles as a Principle Engineer and Project Engineer, focusing on stress and thermal simulation analyses. 威宏 earned a Master's degree in Engineering Science from 國立成功大學 and a Bachelor's degree in Bio-Medical Engineering from 國立嘉義大學.
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