Benjamin Lai possesses a diverse background in engineering and materials science, with a Bachelor's degree from Cornell University. Experience includes roles as a Sample Analysis Intern at AmeriSci, where skills in asbestos and environmental analysis were developed, and as a Powder Metallurgy R&D Intern at North American Hoganas, focusing on the mechanical properties of steel and nanoparticles. Benjamin has demonstrated significant expertise in semiconductor processing at GLOBALFOUNDRIES, advancing from an Electroplating Shift Process/Equipment Engineer to a Senior Chemical Mechanical Planarization Process Engineer, where contributions led to substantial cost reductions and process improvements. Currently, Benjamin serves as a Design Engineer in the DUV defectivity group at ASML, emphasizing advanced semiconductor technologies. Additionally, an extended period of international travel provided a broadened perspective through immersion in various cultures.
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