Bin Wang is a Senior Software Engineer at ASML, where they are developing OPC tools to optimize next generation curvilinear photomasks for advanced technology nodes. They earned a Ph.D. in Physics from the University of Colorado Boulder, where they focused on generating tabletop high harmonic Extreme Ultraviolet (EUV) sources and their applications in reflectometry and microscopy for semiconductor inspection. Bin has held positions as a Postdoctoral Researcher and Research Assistant, contributing to significant imaging projects that garnered funding from DARPA and Intel. Their strong technical expertise includes designing EUV reflectometers and computational imaging systems, demonstrating a commitment to advancing semiconductor metrology techniques. Bin also holds a Bachelor of Science in Optical Information Science and Technology from the University of Science and Technology of China.
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