Boran Jia is an experienced professional with a diverse background in research and engineering, having served as a Visiting Researcher at the University of Wollongong, focusing on micro forming experiments and heat treatment of stainless steel foils. At ASML, Boran held multiple roles including Technical Project Lead for the EUV CS Defectivity Cluster and Competency Engineer, specializing in EUV scanner vacuum systems and wafer defectivity. Additionally, Boran contributed to student administration and human resources at Northeastern University in China and developed fast prototyping methods for MEMS devices at Delft University of Technology, employing various materials and advanced inspection techniques.
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