Brian Lee is a System Engineer for EUV Power at ASML, specializing in laser-to-wafer architecture design. They earned a Master of Science in Mechanical Engineering with a focus on plasma physics and EUV lithography from UC San Diego, where they also completed a Bachelor of Science in the same field. Brian has held various engineering roles, including Senior Laser and Plasma Physics Engineer and Mechanical Design Engineer, and has successfully led teams in developing innovative solutions, enhancing performance, and creating educational resources. Their experience spans research, product management, and instruction, reflecting a strong foundation in both technical expertise and leadership.
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