Daniel Fenstermaker is a graduate physicist currently working as a Software Applications Engineer at ASML-Brion, specializing in laser-based micromachining for the flexible circuit industry. They previously held a position as a Principal Engineer at GLOBALFOUNDRIES, focusing on EUV lithography process modeling for advanced technology nodes. With over three years of experience in the semiconductor industry, Daniel has extensive knowledge in metrology, data analysis, and photomask patterning solutions. Their educational background includes a Master of Science in Applied Physics from the University of Oregon and a Bachelor of Science in Physics from Virginia Polytechnic Institute and State University.
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