Jiayin Chu is a process development engineer with over five years of experience in the technology industry. They have worked on the dry-etching process at TSMC, where they improved wafer uniformity and yield, while also collaborating with various teams to enhance production efficiency. Currently, Jiayin serves as a senior application engineer at ASML, following previous roles at Headway Technologies and SUMIKA TECHNOLOGY CO., LTD., where they developed innovative analytical methods and enhanced lab operations. Jiayin holds a Bachelor's and Master's degree in chemistry from 國立交通大學 and 國立臺灣大學, respectively.
This person is not in the org chart
This person is not in any teams
This person is not in any offices