Jim Overkamp

Jim Overkamp is a researcher at ASML, where they investigate thermal effects in DUV immersion wafer tables and develop models for future EUV systems. Prior to this role, Jim served as an architect in the Research EUV-Next project at ASML, focusing on future EUV scanners. They began their career with a master's degree in Applied Physics from Eindhoven University of Technology, following a bachelor's degree in the same field from the same institution. Additionally, Jim held positions as a physics engineer with TMC and interned at Wärtsilä in the CFD department.