Kohei Hayashi is an experienced application engineer specializing in E-beam metrology and inspection, currently employed at ASML Japan since July 2025. Prior to this role, Kohei worked as a QR Failure Analysis Senior Engineer at TSMC from January 2023 to July 2025, focusing on failure analysis using SEM, TEM, and FIB for N12-28 logic devices. Kohei's experience also includes serving as an R&D Metrology Process Engineer at Micron Technology from December 2019 to December 2022, overseeing SEMCD processes for DRAM development, and as a Dry Etching Process Engineer at Melco Semiconductor Engineering Co., Ltd. from April 2018 to October 2019, where responsibilities included expanding production capacity and developing new MOSFET and IGBT devices. Kohei holds a Master's degree in Polymer Science from Nagasaki University, completed in March 2018.
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