Lee Jisun is a Senior Design Engineer at ASML, engaging in the NTP project with major chip makers. Prior to this role, Lee served as a Senior Application Engineer at Samsung Electronics, focusing on FEOL process integration and yield engineering. With experience in DRAM process integration at various nodes, Lee has a strong background in failure analysis and process module leadership. Lee holds a Master of Science degree in Chemistry and Nano Science, as well as a Bachelor of Science degree in Chemistry from Ewha Womans University.
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