世宇 劉 is a seasoned project leader at ASML with over three years of experience in integrating competency resources and managing new product rollouts. They have earned recognition from headquarters for securing the worldwide product market and received an award for their contributions. Prior to their current role, 世宇 worked as an escalation leader and a defect team engineer at TSMC, where they developed a new system that reduced monitor wafers by 10%. 世宇 holds a Master's degree in Applied Mechanics from National Taiwan University and a Bachelor's degree in Mechanical Engineering from National Chung Cheng University.
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