Rui-Ling Lai is a Principal Electrical Design Engineer at ASML, a position held since 2018. They previously served as Vice Manager at UBEC from 2007 to 2012, specializing in RF front-end chip design. Rui-Ling has also worked as a Senior Electrical Design Engineer at Hermes-Microvision, Inc. since 2012, focusing on analog PCB circuit design and automatic test bench development. Rui-Ling holds a Bachelor's degree in Electronic Engineering from National Chiao Tung University and a Ph.D. in the same field from 國立交通大學.
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