Ben Tan is a skilled Software Engineer with experience at ASMPT Ltd since November 2021, focusing on the development of wire bonding machine Windows applications. Prior to this role, Ben worked at Motorola Solutions from January 2020 to November 2021 as a platform and low-level embedded software engineer. Experience includes an internship at Jabil providing SAP Purchasing and Material Management functional support and administrative duties at WMSPI. Ben Tan holds a Bachelor's degree with Honors in Computer Science (Multimedia Computing) from Universiti Tun Hussein Onn Malaysia, completed in 2020, and has further education at Zero To Mastery Academy.
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