Jacob Jordan

Research Engineer (fowlp Lead & Packaging Group ISO Representative) at Institute of Microelectronics

Jacob Jordan is a Research Engineer at Institute of Microelectronics, with experience in FOWLP processes and packaging. Jacob has also worked as an Encapsulation Module Lead, focusing on encapsulation projects and equipment maintenance. In the past, Jacob completed internships at Setsco Services and ST Engineering, gaining practical experience in non-destructive testing and aircraft components. Jacob holds a Bachelor's degree in Aeronautics/Aerospace Science and Technology, as well as diplomas and certificates in Mechanical Engineering and Aerospace Avionics.

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