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Institute of Microelectronics
Soh Serine

SS

Soh Serine

Fan-out Wafer Level Packaging (development & Integration) at Institute of Microelectronics

About

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Manager

Nandini Venkataraman

Module Lead

Peers

Mohd Hazwani Khairy Mohd Husni

Research Engineer

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Timeline

Fan-out Wafer Level Packaging (development & Integration)
September, 2013 - present

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