Bond Jiang is currently a TPM at Asteelflash, where they manage projects, develop technology, and oversee cost calculations. They have also served as a Software Design Engineer in Test and Test Development Engineer at 捷普, providing global technical support. Previously, Bond worked as a Testing Engineer at Flextronics China from 2002 to 2014, where they supported various testing processes for wireless routers, mobile phones, and power suppliers. Bond holds degrees in Engineering Science and Computer Technology from multiple institutions, including 东吴大学 and Soochow University.
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