Ken Wang is an experienced engineering professional with a strong background in packaging and integration within the semiconductor and electronics industries. Currently serving as a Manufacturing Integration Engineer at Ayar Labs since June 2022, Ken previously held roles at Apple as a Light Sensor and Proximity Module Development Engineer, where responsibilities included component development and collaboration with various teams on sensor technologies. Prior experience includes serving as a Principal Assembly/Integration Engineer at Thin Film Electronics and a Principal MTS Packaging Engineer at Linear Technology, focusing on optimization and development of sensor packages. Ken began a career as a Senior Staff Packaging Engineer at Broadcom Corp. and a Senior Packaging Engineer at Sandisk Corp., contributing significantly to design and integration processes. Ken holds a Bachelor of Science degree in Mechanical Engineering from San Francisco State University.
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