Brian Bogdan is a Senior Principal Engineer in Hardware Design at BAE Systems, Inc., where they lead circuit pack design activities from requirements creation to production release. With experience in digital design and circuit specification across various projects, Brian has been engaged in the development of advanced wireless embedded systems. They previously worked as a Senior Electrical Engineer at General Dynamics Mission Systems and have a strong background in digital design from their tenure at Alcatel-Lucent. Brian is currently pursuing a Bachelor's degree in Electrical and Electronics Engineering from the State University of New York and has completed an AAS at Mohawk Valley Community College.
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