Felix Heil is a Software Platform Architect for Embedded Systems at Balluff EMEA, where they have overseen the in-house embedded platform and framework for Ethernet-based products since 2023. Previously, Felix held the role of Software Architect for the same company from 2020 to 2023 and served as an Embedded Software Engineer at Balluff worldwide from 2018 to 2020. Before that, they worked as a Development Engineer for Embedded Software at Leuze electronic GmbH + Co. KG in 2017-2018. Felix earned a Bachelor of Engineering in Technical Computer Science from Hochschule Esslingen - University of Applied Sciences between 2013 and 2017.
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