BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

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BE Semiconductor Industries NV

Richard Blickman

Leon Verweijen

René Hendriks

J.K. Park

Henk-Jan Jonge Poerink

Bart Berenbak

Jeroen Kleijburg

Peter Wiedner

Christoph Scheiring

Ruurd Boomsma

BE Semiconductor Industries NV

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