Smith Harry is a digital circuit design engineer at 壁仞科技 since 2022, where they focus on low-speed universal interface IP design and the development of security-related IPs and patents. Previously, they worked as a digital circuit verification engineer at 高云半导体 Gowin Semiconductor Corp in 2020, specializing in algorithm-related IP verification and automated simulation scripts. Smith obtained a master’s degree in Electronics from 新加坡南洋理工大学 in 2022 and a bachelor’s degree in Microelectronics Science and Engineering from 山东大学 in 2021.
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