Wayne Bao is a Senior Software Engineer at Bloomberg LP, specializing in edge access and security. With 9 years of experience in big data and distributed/cloud systems, Wayne previously worked as a Research Assistant at Fudan University, where they built a manufacturing line for micrometer-level blood pressure sensors and designed an SFGT cell for memory applications. They also gained experience as a Firmware Process Intern at Micron Technology, where they enhanced a NAND flash memory simulator and contributed to Agile development initiatives. Wayne holds a Master of Science in Electrical and Electronics Engineering from the University of Southern California and a Bachelor of Science in Microelectronics from Fudan University.
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