Vito Cheng is a Senior Development Engineer at Bosch, specializing in ASIC packaging. Previously, Vito worked as an R&D Engineer at Tong Hsing Electronic Ind. from 2011 to 2020, where they focused on processes such as wafer bonding, backside grinding, and thermal stress analysis for electronic packages. Vito also held the position of Senior Process and Product Engineer at TAI-SAW Technology from 2006 to 2011. They earned a Master's degree in Mechanical Engineering from Yuan Ze University, completing their studies in 2006.
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